Subject Description : The PCB layout constraint for CSP package
The CSP(like a BGA) package is shown as image_1.bmp. After schematics are translated into PCB editor, the component is shown as image_2.bmp. The red circle around a pad on image_2.bmp is automatically added by kicad, and the inner pad can not be connected with wire due to the red circle. my question is where i can change or modify it. The ball pith is only 0.55mm(V) and 0.6mm(H).